TD-SCDMA Update
January 05, 2007
- Rising Microelectronics, together with COMMIT, has completed field trials for Rising's RS1012 RF (Radio Frequency) transceiver chipset in Shanghai. RS1012 has met all criteria required by 3GPP (3rd Generation Partnership Project) and is ready for commercialization.
- Spreadtrum Communication plans to roll out 3.5G TD-SCDMA chipsets that support HSDPA (High Speed Downlink Packet Access) protocol. Spreadtrum is expected to manufacture the new chipsets using 90-nanometer process technology.